Investigating quality of adhesion in thyristor structures by photoacoustic mathod / Zbigniew Suszyński, Robert Arsoba, Piotr Majchrzak.
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ArtykułJęzyk: angielski Szczegóły wydania: 2001.Tematy: Rodzaj/forma:
W: 25 International Conference and Exhibition IMAPS–Poland 2001 : Rzeszów–Polańczyk 26–29 September 2001. - Rzeszów, 2001. s. 71-74Streszczenie: In this paper opportunities of adhesion assessment between silicon and molybdenum layers in power thyristors are presented. For the diagnostic of the structure, the photoacoustic method, witch is one of thermal methods was used. Amplitude and phase photoacoustic images show the same areas of delamination as the pictures from scanning acoustic microscope. In the contrary to the acoustic method, the photoacoustic one is non-contact and does not require the sample to be immersed in the coupling fluid.
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In this paper opportunities of adhesion assessment between silicon and molybdenum layers in power thyristors are presented. For the diagnostic of the structure, the photoacoustic method, witch is one of thermal methods was used. Amplitude and phase photoacoustic images show the same areas of delamination as the pictures from scanning acoustic microscope. In the contrary to the acoustic method, the photoacoustic one is non-contact and does not require the sample to be immersed in the coupling fluid.