APA

SUSZYŃSKI Z., National Conference on Network Theory and Electronic Circuits, . (1996). Application of the 3-D model to the thermal analysis of the semiconductor structure soldered to the lead frame. : .

Chicago

SUSZYŃSKI Zbigniew, National Conference on Network Theory and Electronic Circuits, . 1996. Application of the 3-D model to the thermal analysis of the semiconductor structure soldered to the lead frame. : .

Harvard

SUSZYŃSKI Z., National Conference on Network Theory and Electronic Circuits, . (1996). Application of the 3-D model to the thermal analysis of the semiconductor structure soldered to the lead frame. : .

MLA

SUSZYŃSKI Zbigniew, National Conference on Network Theory and Electronic Circuits, . Application of the 3-D model to the thermal analysis of the semiconductor structure soldered to the lead frame. : . 1996.