Thermal diagnostic of power thyristor / Zbigniew Suszyński, Robert Arsoba, Piotr Majchrzak.
Rodzaj materiału:
ArtykułJęzyk: angielski Tematy: Rodzaj/forma: W : International workshop on thermal investigations of ICs and systems : plus a special half-day on dynamic measurements : THERMINIC, Paris, France, 24-27 September 2001. - Grenoble : TIMA, 2001. - s. 180-184Streszczenie: In this paper a non-destructive photothermal method of testing, namely Thermal Wave Microscopy (TWM), is applied to assess the quality of adhesion between the silicon and molybdenum layers in power thyristor structures.
Brak egzemplarzy dla tego rekordu
sprawozdanie jednostki (Informator o publikowanych wynikach prac naukowo-badawczych w 2002 roku Wydziału Elektroniki).
In this paper a non-destructive photothermal method of testing, namely Thermal Wave Microscopy (TWM), is applied to assess the quality of adhesion between the silicon and molybdenum layers in power thyristor structures.