Investigation of sensibility of thermal impedance on selected parameters of three-layered structure /
MAJCHRZAK, Piotr. Politechnika Koszalińska - Wydział Elektroniki i Informatyki, Katedra Inżynierii Komputerowej 1998 - .
Investigation of sensibility of thermal impedance on selected parameters of three-layered structure / Piotr Majchrzak, Zbigniew Suszyński.
Dane z autopsji.
In the paper a method of analysis of sensibility of layered structure thermal impedance for changing of selected parameters values was presented. The parameters analysed were quotient of thickness and square root of thermal diffusivity of selected layer and quotient of effusivities of adjoined layers. The TLM (Transmisja-Line Modeling) method was used for the valculations.
Materiały konferencyjne.
Investigation of sensibility of thermal impedance on selected parameters of three-layered structure / Piotr Majchrzak, Zbigniew Suszyński.
Dane z autopsji.
In the paper a method of analysis of sensibility of layered structure thermal impedance for changing of selected parameters values was presented. The parameters analysed were quotient of thickness and square root of thermal diffusivity of selected layer and quotient of effusivities of adjoined layers. The TLM (Transmisja-Line Modeling) method was used for the valculations.
Materiały konferencyjne.