TY  - GEN
AU  - SUSZYŃSKI,Zbigniew, Politechnika Koszalińska - Wydział Elektroniki i Informatyki
AU  - MAJCHRZAK,Piotr, Politechnika Koszalińska - Wydział Elektroniki i Informatyki
AU  - KOSIKOWSKI,Mateusz, Politechnika Koszalińska - Wydział Elektroniki i Informatyki
ED  - International Conference IMAPS-Poland  2006
TI  - Determining of thermal properties of interlayer in copper-corundum bonding using Artificial Neural Net
KW  - Materiały konferencyjne
N1  - Dane z autopsji
N2  - In the paper a method of thermal parameters estimation of interlayer in copper-corundum ceramics (Al2~(O3~() bounding is presented. During experiment, a photoacoustic method was used for determining the real thermal-wave characteristics. Parameters of measurement process were defined by investigation of thermal impedance sensivity upon changes of intermediate layer thermal parameters. The theoretical characteristics were appointed with the help of 1-D heat flow thermal model. The fitting of theoretical characteristics to the measured ones was realized by artificial neural network (ANN)
ER  -