TY  - GEN
AU  - SUSZYÅSKI, Zbigniew.
ED  - National Conference on Network Theory and Electronic Circuits
TI  - Application of the 3-D model to the thermal analysis of the semiconductor structure soldered to the lead frame
PY  - 1996///
KW  - MateriaÅy konferencyjne
N1  - Dane z bibliografii zaÅÄcznikowej
ER  -